PCB Specification
<name of pcb>
Document No. DEV.0400en
Version: 01
13.09.2022

Status: Entwurf

Freigabe:

Name	Funktion bei MAB	Datum	Unterschrift

Inhalt

1	Scope	4

1.1	Usage	4

1.2	Sources	4

1.3	Abbreviations	4

2	Introduction of component	5

2.1	Usage	5

2.2	Functionality	5

3	General requirements	6

3.1	Norms	6

3.2	Standards	6

3.3	Certifications	6

3.4	Storage temperature	6

3.5	Operating humidity	6

3.6	Diagnostics	6

4	Mechanical requirements	7

4.1	Dimensions	7

4.2	Material	7

4.3	Layers	7

4.3.1	Number	7

4.3.2	Thickness chopper inside-layer	7

4.3.3	Thickness chopper outside-layer	7

4.3.4	Thickness overall PCB	7

4.3.5	Circuit path	7

4.3.6	Drillings	7

4.3.7	Shape	8

4.3.8	Production	8

4.3.9	Testing-points	8

5	Coating	9

5.1.1	Surface	9

5.1.2	Solder resist	9

5.1.3	Assembly pressure	9

5.1.4	Labelling	9

6	Processing	10

6.1.1	Production information	10

6.1.2	Layer-structure	10

Appendix	12

Document History	12

Scope

This document describes the technical characteristics a PCB must have for a defined MAB project.

Usage

This document is used for inquiries to PCB producers.

This document is used by the PCB producer to evaluate if the requirements can be matched.

This document is used to make sure that the requirements to the PCB are met.

Sources

The content comes from the development department at MAB.

Abbreviations

MAB	Müller Apparatebau Kranzberg
PCB	Printed Circuit Board

Tabelle 11: Abbreviations

Introduction of component

This chapter describes the requirements the PCB has to meet.

Usage

The component is used as a PCB for the product <name of product>.

Functionality

<some words about the product>

General requirements

This chapter describes the necessary fulfilling of norms, standards or certification and general requirements.

Norms

RoHS-Norm

REACH

Standards

ISO 9001

Certifications

UL

Flammability: V0

Storage temperature

-10°C to 50°C

Operating humidity

max. 70% rH

Diagnostics

E-Test PCB

Mechanical requirements

Dimensions

<x> mm x <y> 40mm

Material

Epoxy

FR4

TG150

Layers

Number

<number of layers> layers

Thickness chopper inside-layer

35um

Thickness chopper outside-layer

35um

Thickness overall PCB

1.6mm +- 0.1mm

Circuit path

Minimum circuit path width:	0.2mm

Maximum circuit path width:	0.2mm

Drillings

Smallest diameter of drilling hole:	0.5mm

Biggest diameter of drilling hole:	3.2mm

Number of Buried Vias:	0

Total number of drilling holes:	270

Shape

Smallest cutter diameter:	1.6mm

Production

Single circuit board

Testing-points

Number: <number of testpoints for ICT>

Coating

Surface

chemical nickel/gold (Ni/Au)

Solder resist

Layers:	Top + Bottom

Color:	green

Assembly pressure

Layer:	Top

Color:	white

Labelling

UL

According to standards

Processing

Production information

Gerber-X2 Files

NC Drill File

Layer-structure

Layer-1: <name>Top.gbr

Layer-2: <name>Bot.gbr

Example of layer stack

figure 1 - Board Layer Stack

Views of the circuit board

<Examples of picture of board>

figure 2 – view circuit board <name>– Top

figure 3 – view circuit board <name> - Bottom

Appendix

Document History

Date	Version	Autor	Comment
18.11.2019	01	GRZ	Creation of spec.-template
02
03
04
05
06