PCB Specification
<Name of pcb>
Version: 01
24.03.2021

Status: draft

Document Owner:

<name of engineer>

Red text must be replaced with black texts. Specification has to be reviewed by E/E colleague and approved by Director Development.

Content

Chapters

1	Content	2

1.1	Chapters	2

1.2	Tables	4

1.3	Figures	4

1.4	Acronyms	4

1.5	References	4

2	Scope	5

2.1	Usage	5

2.2	Content sources	5

3	Introduction of component	6

3.1	Usage	6

3.2	Functionality	6

4	General requirements	7

4.1	Norms	7

4.2	Standards	7

4.3	Certifications	7

4.4	Storage temperature	7

4.5	Operating humidity	7

4.6	Diagnostics	7

5	Mechanical requirements	8

5.1	Dimensions	8

5.2	Material	8

5.3	Layers	8

5.3.1	Number	8

5.3.2	Thickness chopper inside-layer	8

5.3.3	Thickness chopper outside-layer	8

5.3.4	Thickness overall PCB	8

5.3.5	Circuit path	8

5.3.6	Drillings	8

5.3.7	Shape	8

5.3.8	Production	8

5.3.9	Testing-points	8

6	Coating	9

6.1.1	Surface	9

6.1.2	Solder resist	9

6.1.3	Assembly pressure	9

6.1.4	Labelling	9

7	Processing	10

7.1.1	Production information	10

7.1.2	Layer-structure	10

7.1.3	Views of the circuit board	11

8	Change history	12

Tables

table 1: Change History

Figures

figure 1 - Board Layer Stack	10

figure 2 – view circuit board <name>– Top	11

figure 3 – view circuit board <name> - Bottom	11

Acronyms

MAB	Müller Apparatebau Kranzberg

V	Voltage

I	Current

P	electric power

PCB	printed circuit board

References

Production data (Gerber)

NC Drill (Bohrdatei)

Scope

This document describes the technical characteristics a pcb must have for a defined MAB project.

Usage

This document is used for inquiries to pcb producers.

This document is used by the pcb producer to evaluate, if he can match the requirements.

This document is used to make sure that the requirements to the pcb are met.

Content sources

The content comes from the development department at MAB.

Introduction of component

This chapter describes the requirements the pcb has to meet.

Usage

The component is used as a pcb for the product <name of product>.

Functionality

<some words about the product>

General requirements

This chapter describes the necessary fulfilling of norms, standards or certification and general requirements.

Norms

RoHS-Norm

REACH

Standards

ISO 9001

Certifications

UL

Flammability: V0

Storage temperature

-10°C to 50°C

Operating humidity

max. 70% rH

Diagnostics

E-Test PCB

Mechanical requirements

Dimensions

<x> mm x <y> 40mm

Material

Epoxy

FR4

TG150

Layers

Number

<number of layers> layers

Thickness chopper inside-layer

35um

Thickness chopper outside-layer

35um

Thickness overall PCB

1.6mm +- 0.1mm

Circuit path

Minimum circuit path width:	0.2mm

Maximum circuit path width:	0.2mm

Drillings

Smallest diameter of drilling hole:	0.5mm

Biggest diameter of drilling hole:	3.2mm

Number of Buried Vias:	0

Total number of drilling holes:	270

Shape

Smallest cutter diameter:	1.6mm

Production

Single circuit board

Testing-points

Number: <number of testpoints for ICT>

Coating

Surface

chemical nickel/gold (Ni/Au)

Solder resist

Layers:	Top + Bottom

Color:	green

Assembly pressure

Layer:	Top

Color:	white

Labelling

UL

According to standards

Processing

Production information

Gerber-X2 Files

NC Drill File

Layer-structure

Layer-1: <name>Top.gbr

Layer-2: <name>Bot.gbr

Example of layer stack

figure 1 - Board Layer Stack

Views of the circuit board

<Examples of picture of board>

figure 2 – view circuit board <name>– Top

figure 3 – view circuit board <name> - Bottom

Change history

last version: 01

date	Version	author	comment (detailed, clear, reference to page)
18.11.2019	01	Michael Grzan	Creation of spec.-template

table 1: Change History

document status: temporary (authorized, copy, changed)